MT-2804 Potting Adhesive 1:1
| Model | MT-2804 |
|---|---|
| Proportion (weighet) | 1:01 |
| Viscosity-BF (Cp) | A: 2800-3400 B: 2600-3400 |
| Color | Gray |
| Viscosity-AF (Cp) | 2600-3400 |
| Density (g/ml) | 1.66±0.02 |
| Surface Cure Time (Min) | 40-60 |
| Full Cure Time (H) | 2-4 |
| Conductivity (W/m-k) | 0.8 |
| Hardness (shore A) | 53-63 |
| Dielectric Strength (kV-mm) | ≥21 |

Introduction:
Two-component silicone is distinguished and named for the single component silica gel.This product consists of two components and cures after mixing the two components in the right proportion.Generally divided into Condensation type and Addition type, the biggest difference between the two is Condensation type will release low-molecular substance and Addition type will not, So Condensation type potting will shrink during curing and Addition type potting will not.
Applications:
It can use in the high power electronic components, modular power supplies and circuit boards for potting protection,which has good heat conduction and temperature resistance. Such as LED driver power ,automotive HID lamp module power supply, automotive ignition system module power supply, network transformers, etc.
Instruction:
Two-component addition type potting:
① Before use, the A component and B component in their respective containers fully mixing evenly, and then according to the weight ratio of A:B=1:1, put into the mixing tank mixing evenly.
②Put the mixture into the container. Curing at room temperature or heating. In the winter, it will take a long time to cure,suggested by heating curing, curing under 80℃ for 15-30 minutes , and at room temperature, generally takes about 3~5 hours curing.
Caution:
①Glue should be sealed storage. The mixture should be used once to avoid waste.
②This product is not dangerous, but do not eat and into the eyes.
③After a long period of storage, there will be precipitation in the glue. Please mix evenly to use and does not affect the performance.
④Glue exposure to a certain amount of the following chemical substances will make the glue does not solidify ( little amount of the following substances will not affect the curing)
· N, P, S organic compounds
· Ionic compounds of Sn, Pb, Hg, As and other elements
Containing alkynes and vinyl compounds
· In order to avoid the above phenomenon, the use of the circuit board as far as possible to wipe clean the remaining rosin, try to use low lead content of solder. It can also use three anti - paint soaked, and then use glue.
⑤Before a large amount of use,Please try a small amount of trial to confirm Is it appropriate.
Packing:
Two-component addition type potting: 50Kg/ set Size of 20L Barrel: D30xH38.5cm
Customized special package
Storage And Transport:
①The storage period see the TDS.
②Such products are non hazardous and can be transported in general chemicals
Need Support?
For technical questions, product issues, or assistance with any of our interconnectsystems.
Connect with an Engineer
For guidance on product selection, technicalspecifications, compatibility, or designrecommendations.
Request a Quote
For formal quotations, pricing, or configuration-based requests.
Professional Electronic Silicone Manufacturer
Your Reliable Partner for Thermal & Adhesive Solutions
We specialize in custom silicone solutions for New Energy, Automotive, and Electronics industries. ISO & UL certified, we deliver high-performance products backed by expert R&D and advanced manufacturing.



