MT-1801 Potting Adhesive 10:1
| Model | MT-1801 |
|---|---|
| Proportion (weighet) | 10:01 |
| Viscosity-BF (Cp) | 2000-2800/20-30 |
| Color | Black |
| Viscosity-AF (Cp) | 2000-2800 |
| Density (g/ml) | 1.45±0.02 |
| Surface Drytime (Min) | 40-60 |
| Full Cure Time (H) | 4-6 |
| Hardness (shore A) | 30-40 |
| Dielectric Strength (kV/mm) | ≥21 |
Introduction:
Before use: First, stir component A thoroughly to re-disperse any sediment,and shake component B well while sealed. Then mix components A and B at a
weight ratio of 10:1 in a mixing container. A higher proportion of component B will accelerate curing.
Pour the mixed adhesive into the components to be potted. Degassing under vacuum is generally not required, but recommended for deep potting to prevent bubbles or pinholes on the cured surface.
Do not fully seal or expose potted components to high temperatures (>100℃)until small molecules released during curing have fully escaped. If hermetic sealing is required, wait 3 days in summer or 7 days in winter before sealing.
Applications:
Two-component condensation type potting: Primarily used for potting protection of PCBs, outdoor LED lighting fixtures, automotive electronic modules, electrical appliances, light sources, lamps and their accessories,providing sealing, waterproofing and insulation.
Packing:
Two component condensation sealing adhesive: 11Kg/set 10L
large barrel size: D26xH28cm22Kg/set 20L large barrel size: D30xH38.5cm
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