Industrial Electronics – Silicone Product Application Solutions

作者 Gubang | Jul 24, 2026

Table of Contents

Scope of Application: Inverters, servo drives, industrial power supplies, PLCs, sensors, rail transit, and power electronics across the full domain

1. Industrial Electronics Industry Overview

1.1 Industrial Electronics Industry Development Trends

The global industrial electronics market continues to grow, driven by Industry 4.0, smart manufacturing, and the energy transition. In 2026, China's industrial electronics market exceeded RMB 800 billion, with core categories such as inverters, servo drives, industrial power supplies, PLCs, sensors, and power electronics dominating the landscape. With the mass adoption of silicon carbide (SiC) and gallium nitride (GaN) wide-bandgap semiconductors, the power density, switching frequency, and operating temperature of industrial electronics products have risen across the board, imposing more stringent requirements on thermal management and protection materials.

Electronic silicone materials are used in industrial electronics for power-device heat dissipation, PCBA protection, component potting, and structural sealing. Industrial electronics products typically face harsh conditions—high temperature, high humidity, high vibration, dust, and salt spray. The temperature resistance, insulation, flame retardancy, and long-term reliability of silicone materials determine the overall service life of the product.

1.2 Core Value of Electronic Silicone in Industrial Electronics

Value Dimension

Specific Application

Result

Thermal Dissipation

IGBT/SiC module cooling, high-frequency transformer cooling

Reduce temperature rise by 20–40℃; double device service life

Insulation Protection

High-voltage busbar insulation, transformer insulation potting

Withstand voltage 3–10 kV; compliant with UL/IEC safety standards

Conformal Coating Protection

Control board coating, I/O module protection

Moisture-/salt-spray-/mold-resistant; suitable for harsh environments

Flame-Retardant Safety

Power supply potting, terminal encapsulation

UL94 V-0; passes 960℃ glow-wire test

Anti-Vibration Protection

Buffer potting for high-power devices

Withstands 20 G random vibration; no fracture over 10 years

Thermal Bonding

Heat-sink bonding and fixation, thermal gap filling

Reduce contact thermal resistance; replace mechanical fixation

1.3 Industrial Electronics Classification and Silicone Requirement Mapping

Inverter (0.75–500 kW): IGBT cooling (TC series) → electrolytic capacitor buffer potting (PT series) → control board conformal coating (PC series). Servo drive (50 W–15 kW): power-device cooling (TC series) → encoder sealing (SS series) → terminal insulation (IC series). Industrial power supply (AC/DC, DC/DC): MOSFET/transformer cooling (TC series) → full-board PCB potting (PT series) → housing sealing. PLC/RU/IO modules: power-module thermal conduction (TC series) → main-board conformal coating (PC series) → terminal-block insulation. Industrial sensors: MEMS sensor protection (IC series) → housing sealing (SS series) → cable-entry potting. Rail transit electronics: traction converter cooling (TC series) → auxiliary power potting (PT series) → connector sealing. Power electronics (SVG/APF/UPQC): IGBT cooling (TC series) → reactor potting (PT series) → control board conformal coating

2. Product Portfolio Overview

2.1 Core Product Series

Product Series

Product Name

Typical Model

Key Features

High-Thermal-Conductivity Grease

Power-device cooling

MT-3203/3206

Thermal conductivity 3.0–6.0 W/m·K; low oil bleed; insulating

Thermally Conductive Potting Compound

Power-module potting

MT-2804/2807

Thermal conductivity 0.8–1.5 W/m·K; V-0; low-stress

MT-2806

Dielectric strength >30 kV/mm; tracking resistance CTI >600 V

Flame-Retardant Sealant

Structural sealing and flame retardancy

MT-704A

V-0 flame retardancy + IP67; FIPG-formed

Thermally Conductive Adhesive

Heat-sink bonding

MT-1301

Thermal conductivity 1.0 W/m·K; bond strength >4 MPa

Epoxy-Replacement Silicone

High-thermal-conductivity potting

MT-2808

Thermal conductivity 2.0 W/m·K; 50× lower stress than epoxy

2.2 Product Technical Advantages

6.0 W/m·K ultra-high-thermal-conductivity grease: meets cooling needs of SiC/GaN devices

Low-stress potting formulation: modulus 2–5 MPa; safe for electrolytic capacitors and SMD inductors

10 kV-class insulating potting compound: dielectric strength >30 kV/mm; meets rail transit safety standards

Full V-0 flame-retardant coverage: all products available in UL94 V-0 certified versions

-55℃ to 250℃ wide temperature range: meets extreme industrial environment requirements

3. Inverter Application Solutions

Figure 3-1 Inverter Cooling and PCB Conformal Coating Solution

Figure 3-2 PLC Cabinet Conformal Coating and Servo Drive Cooling

3.1 Inverter Cooling Overview

Inverters span a power range of 0.75 kW to 500 kW+. IGBT module cooling is the core factor determining inverter reliability.

Inverter Power

IGBT Module

Cooling Method

Heat Flux Density

Recommended Grease

0.75~7.5kW

Mini DIP

Natural Convection

2~4 W/cm²

MT-3203

11~45kW

PIM/Econo

Forced Air Cooling

4~7 W/cm²

MT-3203

55~160kW

EconoDual/170mm

Forced Air + Heat Pipe

5~8 W/cm²

MT-3206

200~500kW

Prime/IHM

Liquid Cooling

8~12 W/cm²

MT-3206

3.2 IGBT Module Thermal Solution

Application location: between the IGBT module baseplate and the heat-sink substrate. Recommended products: MT-3203 / MT-3206

Parameter

MT-3203

MT-3206

Thermal Conductivity

3.0 W/m·K

6.0 W/m·K

Thermal Resistance (@50 psi)

0.05 ℃·cm²/W

0.025 ℃·cm²/W

Oil Bleed (200℃/24 h)

<0.3%

<0.2%

Dielectric Strength

>12 kV/mm

>12 kV/mm

Application Scenario

Standard Air Cooling

SiC Module / Liquid Cooling

3.3 Electrolytic Capacitor Buffer Potting

Application location: buffer between the bottom of the inverter busbar electrolytic capacitor and the PCB. Recommended product: MT-2804 low-stress potting compound

Capacitor protection requirements:

  • Elastic modulus <5 MPa; no transmission of vibration stress
  • Thermal conductivity 0.8 W/m·K; assists capacitor heat dissipation
  • Flame retardant class V-0
  • Working time 30–60 min; matches production-line takt

3.4 Inverter Control Board Conformal Coating

4. Servo Drive Application Solutions

4.1 Servo Power Module Cooling

Application location: servo drive power transistor (MOSFET/SiC) cooling. Recommended product: MT-3203 thermal grease (3.0 W/m·K)

Servo drive characteristics:

  • High power density (50 W–15 kW compact package)
  • Strong overload capacity (3× peak current)
  • Various mounting orientations (vertical / wall-mounted / horizontal)
  • Grease must be non-slump and non-bleeding

4.2 Encoder Sealing Solution

Application location: servo motor encoder interface sealing. Recommended product: MT-704A flame-retardant sealant

Requirement

Standard

MT-704A

Protection Grade (IP)

IP67

Oil Resistance

Engine oil / cutting fluid

Temperature Resistance

-20℃~100℃

-55℃~180℃

4.3 Servo Drive Terminal Insulation

Recommended product: MT-2806 high-voltage insulating potting compound. Applications:

  • Power terminal insulation isolation
  • Brake resistor terminals
  • Encoder interface insulation — key indicators:
  • Dielectric strength >30 kV/mm
  • CTI≥600V
  • Flame retardant V-0

5. Industrial Power Supply Application Solutions

5.1 Switching Power Supply Potting Solution

Application location: industrial AC/DC and DC/DC power-module potting. Recommended product: MT-2806 high-thermal-conductivity potting compound

Parameter

MT-2806

Thermal Conductivity

1.2 W/m·K

Flame Retardancy

UL94 V-0

Dielectric Strength

22 kV/mm

Viscosity (mixed)

3000 cP

Working Time

40min

Curing Method

80℃ × 1 h or 25℃ × 24 h

5.2 High-Frequency Transformer / Inductor Potting

Recommended product: MT-2808 high-thermal-conductivity low-stress potting compound. Special requirements for high-frequency transformer potting:

  • Thermal conductivity ≥2.0 W/m·K; export core-winding hot spots
  • Low elastic modulus <3 MPa; avoid core stress cracking
  • Low dielectric loss Df <0.005 @100 kHz
  • CTE matched to copper / core / bobbin thermal expansion

5.3 Industrial Power Supply Conformal Coating Solution

6. PLC and Controller Application Solutions

6.1 PLC Power Module Thermal Conduction

Application location: PLC power-module switching transistor and transformer. Recommended product: MT-3202 (2.0 W/m·K)

PLC module compact-design characteristics:

  • Module width as narrow as 7.5–25 mm
  • Limited heat-dissipation space
  • Heat accumulation with side-by-side modules
  • Grease thermal conductivity must be ≥2.0 W/m·K

6.2 Controller Main-Board Conformal Coating

6.3 Terminal Block Insulation Isolation

Recommended product: MT-2806 high-voltage insulating potting compound. Applications:

  • Insulation between power terminals and signal terminals
  • Relay / optocoupler isolation-slot potting
  • High-voltage wiring terminal potting

7. Industrial Sensor Application Solutions

7.1 Pressure / Temperature Sensor Potting

Recommended product: MT-2806 insulating potting compound. Applications:

  • Pressure-sensor internal circuit protection
  • Temperature-probe lead sealing
  • Flow-sensor circuit potting

7.2 Photoelectric / Proximity Sensor Sealing

Recommended product: MT-704A flame-retardant sealant. Sealing requirements:

  • Protection grade IP67 / IP69K
  • Resistant to industrial chemicals (cutting fluid, cleaning agents)
  • Temperature resistance -40℃ to 125℃
  • Transparent / color options available

7.3 MEMS Sensor Protection

8. Rail Transit Electronics Application Solutions

8.1 Traction Converter Cooling Solution

Application location: rail transit traction converter IGBT module. Recommended product: MT-3206 ultra-high-thermal-conductivity grease (6.0 W/m·K)

Rail Transit Special Requirements

Standard

Assurance

Vibration Resistance

IEC 61373 Cat.1

No oil bleed after 2 million fatigue cycles

Fire-Protection Rating

EN 45545 HL3

Heat release rate <4 MJ/m²

Wide-Temperature Operation

-40℃ to 85℃ (long term)

-55℃~200℃

Service Life

30 years

Aging validation passed

8.2 Auxiliary Power Supply Potting Solution

Recommended product: MT-2808 (EN 45545 fire-rated). Application locations:

  • Train auxiliary inverter
  • Battery charger
  • Air-conditioning power module fire rating: EN 45545 HL3 class (R22/R23 hazard level)

8.3 Rail Connector Sealing

Recommended product: MT-704A (flame-retardant). Applications:

  • Car-end connector sealing
  • External junction-box sealing
  • Signal interface-box sealing
  • Cable potting seal

9. Power Electronics Application Solutions

9.1 SVG/APF Power Module Cooling

Application location: SVG (Static Var Generator) / APF (Active Power Filter) power module. Recommended product: MT-3206 ultra-high-thermal-conductivity grease

Parameter

SVG/APF Scenario

MT-3206 Solution

Power

50~300kVar

Match

IGBT Module

IGBT4/IGBT5

Adapt

Cooling Method

Forced air / liquid cooling

Compatible

Heat Flux Density

5~10 W/cm²

Coverage

9.2 Reactor Potting Solution

Recommended product: MT-2808 high-thermal-conductivity low-stress potting compound. Reactor potting challenges:

  • Large-volume potting (single unit >10 kg)
  • Low shrinkage <0.2%; reduced stress
  • Thermal conductivity ≥2.0 W/m·K
  • Temperature class H (180℃)

9.3 Active Filtering / Energy Storage PCS Protection

Recommended products:

  • Power module cooling → MT-3206
  • Filter inductor potting → MT-2808
  • Control board conformal coating → PC200
  • Cabinet sealing → MT-704A

10. Selection Guide and Technical Data Comparison

10.1 Quick Selection Matrix

Application Scenario

Primary Requirement

Recommended Product

Alternative Product

Inverter IGBT cooling

High thermal conductivity + low oil bleed

MT-3203/1000

MT-3203

Inverter capacitor buffer

Low stress + thermal conductivity

MT-2804

MT-2806

Inverter control board

Conformal coating / dust protection

Servo power-transistor cooling

High thermal conductivity + non-slump

MT-3203

MT-3202

Servo encoder sealing

IP67 + oil resistance

MT-704A

Industrial power supply potting

Flame retardant V-0 + thermal conductivity

MT-2806

MT-2804

High-frequency transformer

High thermal conductivity + low stress

MT-2808

MT-2806

PLC module cooling

Compact + thermal conductivity

MT-3202

MT-3203

Sensor sealing

IP67 + chemical resistance

MT-704A

Rail transit IGBT

Vibration resistance + long life

MT-3206

MT-3203

Rail auxiliary power supply

EN 45545 fire protection

MT-2808 (fire-rated)

MT-2806

SVG/APF module

High thermal conductivity + insulation

MT-3206

MT-3203

['Reactor potting', 'Low shrinkage + thermal conductivity', 'MT-2808', 'MT-2806']

10.2 Selection Flowchart

Industrial electronics silicone selection ─┬─ Thermal ─┬─ IGBT/SiC module → MT-3206 (6.0 W/m·K) / MT-3203 (3.0 W/m·K)                   │         ├─ MOSFET/diode → MT-3203 (3.0 W/m·K) / MT-3202 (2.0 W/m·K)                   │         └─ Transformer/inductor → MT-2808 (2.0 W/m·K potting)                   │                   ├─ Protection ─┬─ Control board coating → PC200 (conformal coating + UV trace)                   │         ├─ Power potting → MT-2806 (V-0 + thermal conductivity)                   │         ├─ High-voltage insulating potting → MT-2806 (30 kV/mm)                   │         ├─ Structural sealing → MT-704A (V-0 + IP67)                   │         └─ Terminal insulation → MT-2806/MT-2806                   │                   └─ Bonding ── Heat-sink fixation → MT-1301 (2.0 W/m·K + 4 MPa)

11. Competitive Advantages

11.1 Technical Advantages

6.0 W/m·K ultra-high-thermal-conductivity grease: matches SiC/GaN device cooling; reduces thermal resistance by 50% vs. standard 3 W/m·K

10 kV-class insulating potting: dielectric strength >30 kV/mm, CTI ≥600 V; passes UL/IEC safety standards

Low-stress epoxy replacement: modulus 2 MPa vs. epoxy 50–100 MPa; safe for cores/capacitors

-55℃ to 250℃ wide temperature range: stable performance across all zones; ideal for extreme industrial environments

Reworkable conformal coating: localized peel-off design cuts rework cost by 50%+

11.2 Quality Advantages

Quality Dimension

Industry Standard

Our Level

Batch Cpk

≥1.33

≥1.67

Thermal Conductivity Tolerance

±0.2 W/m·K

±0.15

Viscosity Tolerance

±20%

±10%

Flame-Retardant Certification

V-0 (self-certified)

V-0 (UL Yellow Card)

Insulation Stability

85℃/85%RH 1000h

Performance retention >95% after 3000 h

['Aging reliability', '125℃/1000 h', '150℃/3000 h passed']

11.3 Service Advantages

  • Thermal simulation support: collaborate with customers on full-system thermal simulation and optimization
  • Samples in 24 h: trial samples matched to customer devices
  • On-site mass production: on-site guidance for the first production lot
  • Safety certification: full documentation for UL/TÜV/EN 45545
  • Custom R&D: co-develop formulations for new devices (SiC/GaN/wide-bandgap)

12. Representative Case Studies

Case 1: 250 kW Inverter IGBT Cooling Upgrade

Customer background:

Leading domestic inverter manufacturer; 250 kW engineering inverter platform

Requirement:

Aging of the original grease raised IGBT junction temperature, limiting long-term full-power operation

Solution:

Replaced with MT-3203; optimized stencil-printing process for consistent thickness

Result:

  • IGBT junction temperature reduced by 22℃; full-power output capability increased by 15%
  • Grease service life extended from 1 year to 3 years (validated by 150℃ aging)
  • Annual usage exceeds 8 tonnes, covering the full product series

Case 2: High-Frequency Transformer Potting Replacing Epoxy

Customer background:

Industrial power supply company; 100 kHz high-frequency DC/DC module

Requirement:

High epoxy potting stress caused core cracking; defect rate 5%

Solution:

MT-2808 high-thermal-conductivity silicone potting replacing traditional epoxy

Result:

  • Core-cracking defect rate reduced from 5% to 0%
  • Thermal conductivity 2.0 W/m·K vs. epoxy 1.0 W/m·K
  • Transformer temperature drop of 8℃; efficiency improved by 0.5%
  • Reworkability changed from non-reworkable to reworkable

Case 3: Rail Transit Traction Converter Cooling

Customer background:

A traction-system supplier under CRRC

Requirement:

Traction IGBT cooling grease must meet EN 45545 + 30-year life + vibration resistance

Solution:

MT-3206 ultra-high-thermal-conductivity grease with custom anti-vibration formulation

Result:

  • Passed EN 45545 HL3 fire-safety certification
  • Oil bleed <0.1% after 2000 h vibration fatigue
  • With liquid cooling, IGBT junction temperature <80℃
  • Completed 30-year accelerated-aging validation

Case 4: Industrial Sensor IP69K Sealing

Customer background:

Sensor supplier for automotive welding lines

Requirement:

Housing with IP69K protection; resistant to 80℃ high-pressure water jet cleaning

Solution:

MT-704A high-adhesion sealant + O-ring assistance

Result:

  • Passed IP69K high-pressure water-jet cleaning test
  • Sealing life extended from 1 year to 5 years
  • Passed 1000 h resistance to industrial cleaning agents

13. Technical Service System

13.1 Pre-Sales Service

Service Item

Content

Response Time

Technical Consultation

Selection + solution + thermal simulation

Within 2 hours

Free Samples

Trial samples matched to customer devices

Within 24 hours

Application Testing

Full-system prototyping / thermal testing

3 business days

Process Solution

Application process + SOP

5 business days

On-Site Visit

Technical exchange + production-line review

Within 1 week

13.2 In-Sales Service

  • First-lot on-site support: engineers provide on-site guidance for potting/coating processes
  • Operation training: SOP preparation + on-site training
  • Equipment integration: provide dispensing/potting/coating equipment parameters
  • Safety documentation: full set of UL/TÜV/EN 45545 documents

13.3 After-Sales Service

  • Quarterly follow-up: quality review + joint assessment
  • Batch traceability: 5-year retained samples + full records
  • Failure analysis: 24 h response + 8D report
  • Technology upgrade: pre-research on next-gen wide-bandgap device formulations

We are committed to providing professional, integrated thermal-conductivity, potting, insulation, and protection solutions for the industrial electronics industry.