Scope of Application: Inverters, servo drives, industrial power supplies, PLCs, sensors, rail transit, and power electronics across the full domain
1. Industrial Electronics Industry Overview
1.1 Industrial Electronics Industry Development Trends
The global industrial electronics market continues to grow, driven by Industry 4.0, smart manufacturing, and the energy transition. In 2026, China's industrial electronics market exceeded RMB 800 billion, with core categories such as inverters, servo drives, industrial power supplies, PLCs, sensors, and power electronics dominating the landscape. With the mass adoption of silicon carbide (SiC) and gallium nitride (GaN) wide-bandgap semiconductors, the power density, switching frequency, and operating temperature of industrial electronics products have risen across the board, imposing more stringent requirements on thermal management and protection materials.
Electronic silicone materials are used in industrial electronics for power-device heat dissipation, PCBA protection, component potting, and structural sealing. Industrial electronics products typically face harsh conditions—high temperature, high humidity, high vibration, dust, and salt spray. The temperature resistance, insulation, flame retardancy, and long-term reliability of silicone materials determine the overall service life of the product.
1.2 Core Value of Electronic Silicone in Industrial Electronics
Value Dimension
Specific Application
Result
Thermal Dissipation
IGBT/SiC module cooling, high-frequency transformer cooling
Reduce temperature rise by 20–40℃; double device service life
Insulation Protection
High-voltage busbar insulation, transformer insulation potting
Withstand voltage 3–10 kV; compliant with UL/IEC safety standards
Conformal Coating Protection
Control board coating, I/O module protection
Moisture-/salt-spray-/mold-resistant; suitable for harsh environments
Flame-Retardant Safety
Power supply potting, terminal encapsulation
UL94 V-0; passes 960℃ glow-wire test
Anti-Vibration Protection
Buffer potting for high-power devices
Withstands 20 G random vibration; no fracture over 10 years
Thermal Bonding
Heat-sink bonding and fixation, thermal gap filling
Reduce contact thermal resistance; replace mechanical fixation
1.3 Industrial Electronics Classification and Silicone Requirement Mapping
Inverter (0.75–500 kW): IGBT cooling (TC series) → electrolytic capacitor buffer potting (PT series) → control board conformal coating (PC series). Servo drive (50 W–15 kW): power-device cooling (TC series) → encoder sealing (SS series) → terminal insulation (IC series). Industrial power supply (AC/DC, DC/DC): MOSFET/transformer cooling (TC series) → full-board PCB potting (PT series) → housing sealing. PLC/RU/IO modules: power-module thermal conduction (TC series) → main-board conformal coating (PC series) → terminal-block insulation. Industrial sensors: MEMS sensor protection (IC series) → housing sealing (SS series) → cable-entry potting. Rail transit electronics: traction converter cooling (TC series) → auxiliary power potting (PT series) → connector sealing. Power electronics (SVG/APF/UPQC): IGBT cooling (TC series) → reactor potting (PT series) → control board conformal coating
2. Product Portfolio Overview
2.1 Core Product Series
Product Series
Product Name
Typical Model
Key Features
High-Thermal-Conductivity Grease
Power-device cooling
MT-3203/3206
Thermal conductivity 3.0–6.0 W/m·K; low oil bleed; insulating
Thermally Conductive Potting Compound
Power-module potting
MT-2804/2807
Thermal conductivity 0.8–1.5 W/m·K; V-0; low-stress
MT-2806
Dielectric strength >30 kV/mm; tracking resistance CTI >600 V
Flame-Retardant Sealant
Structural sealing and flame retardancy
MT-704A
V-0 flame retardancy + IP67; FIPG-formed
Thermally Conductive Adhesive
Heat-sink bonding
MT-1301
Thermal conductivity 1.0 W/m·K; bond strength >4 MPa
Epoxy-Replacement Silicone
High-thermal-conductivity potting
MT-2808
Thermal conductivity 2.0 W/m·K; 50× lower stress than epoxy
2.2 Product Technical Advantages
6.0 W/m·K ultra-high-thermal-conductivity grease: meets cooling needs of SiC/GaN devices
Low-stress potting formulation: modulus 2–5 MPa; safe for electrolytic capacitors and SMD inductors
10 kV-class insulating potting compound: dielectric strength >30 kV/mm; meets rail transit safety standards
Full V-0 flame-retardant coverage: all products available in UL94 V-0 certified versions
-55℃ to 250℃ wide temperature range: meets extreme industrial environment requirements
3. Inverter Application Solutions

Figure 3-1 Inverter Cooling and PCB Conformal Coating Solution

Figure 3-2 PLC Cabinet Conformal Coating and Servo Drive Cooling
3.1 Inverter Cooling Overview
Inverters span a power range of 0.75 kW to 500 kW+. IGBT module cooling is the core factor determining inverter reliability.
Inverter Power
IGBT Module
Cooling Method
Heat Flux Density
Recommended Grease
0.75~7.5kW
Mini DIP
Natural Convection
2~4 W/cm²
MT-3203
11~45kW
PIM/Econo
Forced Air Cooling
4~7 W/cm²
MT-3203
55~160kW
EconoDual/170mm
Forced Air + Heat Pipe
5~8 W/cm²
MT-3206
200~500kW
Prime/IHM
Liquid Cooling
8~12 W/cm²
MT-3206
3.2 IGBT Module Thermal Solution
Application location: between the IGBT module baseplate and the heat-sink substrate. Recommended products: MT-3203 / MT-3206
Parameter
MT-3203
MT-3206
Thermal Conductivity
3.0 W/m·K
6.0 W/m·K
Thermal Resistance (@50 psi)
0.05 ℃·cm²/W
0.025 ℃·cm²/W
Oil Bleed (200℃/24 h)
<0.3%
<0.2%
Dielectric Strength
>12 kV/mm
>12 kV/mm
Application Scenario
Standard Air Cooling
SiC Module / Liquid Cooling
3.3 Electrolytic Capacitor Buffer Potting
Application location: buffer between the bottom of the inverter busbar electrolytic capacitor and the PCB. Recommended product: MT-2804 low-stress potting compound
Capacitor protection requirements:
- Elastic modulus <5 MPa; no transmission of vibration stress
- Thermal conductivity 0.8 W/m·K; assists capacitor heat dissipation
- Flame retardant class V-0
- Working time 30–60 min; matches production-line takt
3.4 Inverter Control Board Conformal Coating
4. Servo Drive Application Solutions
4.1 Servo Power Module Cooling
Application location: servo drive power transistor (MOSFET/SiC) cooling. Recommended product: MT-3203 thermal grease (3.0 W/m·K)
Servo drive characteristics:
- High power density (50 W–15 kW compact package)
- Strong overload capacity (3× peak current)
- Various mounting orientations (vertical / wall-mounted / horizontal)
- Grease must be non-slump and non-bleeding
4.2 Encoder Sealing Solution
Application location: servo motor encoder interface sealing. Recommended product: MT-704A flame-retardant sealant
Requirement
Standard
MT-704A
Protection Grade (IP)
IP67
✓
Oil Resistance
Engine oil / cutting fluid
✓
Temperature Resistance
-20℃~100℃
-55℃~180℃
4.3 Servo Drive Terminal Insulation
Recommended product: MT-2806 high-voltage insulating potting compound. Applications:
- Power terminal insulation isolation
- Brake resistor terminals
- Encoder interface insulation — key indicators:
- Dielectric strength >30 kV/mm
- CTI≥600V
- Flame retardant V-0
5. Industrial Power Supply Application Solutions
5.1 Switching Power Supply Potting Solution
Application location: industrial AC/DC and DC/DC power-module potting. Recommended product: MT-2806 high-thermal-conductivity potting compound
Parameter
MT-2806
Thermal Conductivity
1.2 W/m·K
Flame Retardancy
UL94 V-0
Dielectric Strength
22 kV/mm
Viscosity (mixed)
3000 cP
Working Time
40min
Curing Method
80℃ × 1 h or 25℃ × 24 h
5.2 High-Frequency Transformer / Inductor Potting
Recommended product: MT-2808 high-thermal-conductivity low-stress potting compound. Special requirements for high-frequency transformer potting:
- Thermal conductivity ≥2.0 W/m·K; export core-winding hot spots
- Low elastic modulus <3 MPa; avoid core stress cracking
- Low dielectric loss Df <0.005 @100 kHz
- CTE matched to copper / core / bobbin thermal expansion
5.3 Industrial Power Supply Conformal Coating Solution
6. PLC and Controller Application Solutions
6.1 PLC Power Module Thermal Conduction
Application location: PLC power-module switching transistor and transformer. Recommended product: MT-3202 (2.0 W/m·K)
PLC module compact-design characteristics:
- Module width as narrow as 7.5–25 mm
- Limited heat-dissipation space
- Heat accumulation with side-by-side modules
- Grease thermal conductivity must be ≥2.0 W/m·K
6.2 Controller Main-Board Conformal Coating
6.3 Terminal Block Insulation Isolation
Recommended product: MT-2806 high-voltage insulating potting compound. Applications:
- Insulation between power terminals and signal terminals
- Relay / optocoupler isolation-slot potting
- High-voltage wiring terminal potting
7. Industrial Sensor Application Solutions
7.1 Pressure / Temperature Sensor Potting
Recommended product: MT-2806 insulating potting compound. Applications:
- Pressure-sensor internal circuit protection
- Temperature-probe lead sealing
- Flow-sensor circuit potting
7.2 Photoelectric / Proximity Sensor Sealing
Recommended product: MT-704A flame-retardant sealant. Sealing requirements:
- Protection grade IP67 / IP69K
- Resistant to industrial chemicals (cutting fluid, cleaning agents)
- Temperature resistance -40℃ to 125℃
- Transparent / color options available
7.3 MEMS Sensor Protection
8. Rail Transit Electronics Application Solutions
8.1 Traction Converter Cooling Solution
Application location: rail transit traction converter IGBT module. Recommended product: MT-3206 ultra-high-thermal-conductivity grease (6.0 W/m·K)
Rail Transit Special Requirements
Standard
Assurance
Vibration Resistance
IEC 61373 Cat.1
No oil bleed after 2 million fatigue cycles
Fire-Protection Rating
EN 45545 HL3
Heat release rate <4 MJ/m²
Wide-Temperature Operation
-40℃ to 85℃ (long term)
-55℃~200℃
Service Life
30 years
Aging validation passed
8.2 Auxiliary Power Supply Potting Solution
Recommended product: MT-2808 (EN 45545 fire-rated). Application locations:
- Train auxiliary inverter
- Battery charger
- Air-conditioning power module fire rating: EN 45545 HL3 class (R22/R23 hazard level)
8.3 Rail Connector Sealing
Recommended product: MT-704A (flame-retardant). Applications:
- Car-end connector sealing
- External junction-box sealing
- Signal interface-box sealing
- Cable potting seal
9. Power Electronics Application Solutions
9.1 SVG/APF Power Module Cooling
Application location: SVG (Static Var Generator) / APF (Active Power Filter) power module. Recommended product: MT-3206 ultra-high-thermal-conductivity grease
Parameter
SVG/APF Scenario
MT-3206 Solution
Power
50~300kVar
Match
IGBT Module
IGBT4/IGBT5
Adapt
Cooling Method
Forced air / liquid cooling
Compatible
Heat Flux Density
5~10 W/cm²
Coverage
9.2 Reactor Potting Solution
Recommended product: MT-2808 high-thermal-conductivity low-stress potting compound. Reactor potting challenges:
- Large-volume potting (single unit >10 kg)
- Low shrinkage <0.2%; reduced stress
- Thermal conductivity ≥2.0 W/m·K
- Temperature class H (180℃)
9.3 Active Filtering / Energy Storage PCS Protection
Recommended products:
- Power module cooling → MT-3206
- Filter inductor potting → MT-2808
- Control board conformal coating → PC200
- Cabinet sealing → MT-704A
10. Selection Guide and Technical Data Comparison
10.1 Quick Selection Matrix
Application Scenario
Primary Requirement
Recommended Product
Alternative Product
Inverter IGBT cooling
High thermal conductivity + low oil bleed
MT-3203/1000
MT-3203
Inverter capacitor buffer
Low stress + thermal conductivity
MT-2804
MT-2806
Inverter control board
Conformal coating / dust protection
—
Servo power-transistor cooling
High thermal conductivity + non-slump
MT-3203
MT-3202
Servo encoder sealing
IP67 + oil resistance
MT-704A
—
Industrial power supply potting
Flame retardant V-0 + thermal conductivity
MT-2806
MT-2804
High-frequency transformer
High thermal conductivity + low stress
MT-2808
MT-2806
PLC module cooling
Compact + thermal conductivity
MT-3202
MT-3203
Sensor sealing
IP67 + chemical resistance
MT-704A
—
Rail transit IGBT
Vibration resistance + long life
MT-3206
MT-3203
Rail auxiliary power supply
EN 45545 fire protection
MT-2808 (fire-rated)
MT-2806
SVG/APF module
High thermal conductivity + insulation
MT-3206
MT-3203
['Reactor potting', 'Low shrinkage + thermal conductivity', 'MT-2808', 'MT-2806']
10.2 Selection Flowchart
Industrial electronics silicone selection ─┬─ Thermal ─┬─ IGBT/SiC module → MT-3206 (6.0 W/m·K) / MT-3203 (3.0 W/m·K) │ ├─ MOSFET/diode → MT-3203 (3.0 W/m·K) / MT-3202 (2.0 W/m·K) │ └─ Transformer/inductor → MT-2808 (2.0 W/m·K potting) │ ├─ Protection ─┬─ Control board coating → PC200 (conformal coating + UV trace) │ ├─ Power potting → MT-2806 (V-0 + thermal conductivity) │ ├─ High-voltage insulating potting → MT-2806 (30 kV/mm) │ ├─ Structural sealing → MT-704A (V-0 + IP67) │ └─ Terminal insulation → MT-2806/MT-2806 │ └─ Bonding ── Heat-sink fixation → MT-1301 (2.0 W/m·K + 4 MPa)
11. Competitive Advantages
11.1 Technical Advantages
6.0 W/m·K ultra-high-thermal-conductivity grease: matches SiC/GaN device cooling; reduces thermal resistance by 50% vs. standard 3 W/m·K
10 kV-class insulating potting: dielectric strength >30 kV/mm, CTI ≥600 V; passes UL/IEC safety standards
Low-stress epoxy replacement: modulus 2 MPa vs. epoxy 50–100 MPa; safe for cores/capacitors
-55℃ to 250℃ wide temperature range: stable performance across all zones; ideal for extreme industrial environments
Reworkable conformal coating: localized peel-off design cuts rework cost by 50%+
11.2 Quality Advantages
Quality Dimension
Industry Standard
Our Level
Batch Cpk
≥1.33
≥1.67
Thermal Conductivity Tolerance
±0.2 W/m·K
±0.15
Viscosity Tolerance
±20%
±10%
Flame-Retardant Certification
V-0 (self-certified)
V-0 (UL Yellow Card)
Insulation Stability
85℃/85%RH 1000h
Performance retention >95% after 3000 h
['Aging reliability', '125℃/1000 h', '150℃/3000 h passed']
11.3 Service Advantages
- Thermal simulation support: collaborate with customers on full-system thermal simulation and optimization
- Samples in 24 h: trial samples matched to customer devices
- On-site mass production: on-site guidance for the first production lot
- Safety certification: full documentation for UL/TÜV/EN 45545
- Custom R&D: co-develop formulations for new devices (SiC/GaN/wide-bandgap)
12. Representative Case Studies
Case 1: 250 kW Inverter IGBT Cooling Upgrade
Customer background:
Leading domestic inverter manufacturer; 250 kW engineering inverter platform
Requirement:
Aging of the original grease raised IGBT junction temperature, limiting long-term full-power operation
Solution:
Replaced with MT-3203; optimized stencil-printing process for consistent thickness
Result:
- IGBT junction temperature reduced by 22℃; full-power output capability increased by 15%
- Grease service life extended from 1 year to 3 years (validated by 150℃ aging)
- Annual usage exceeds 8 tonnes, covering the full product series
Case 2: High-Frequency Transformer Potting Replacing Epoxy
Customer background:
Industrial power supply company; 100 kHz high-frequency DC/DC module
Requirement:
High epoxy potting stress caused core cracking; defect rate 5%
Solution:
MT-2808 high-thermal-conductivity silicone potting replacing traditional epoxy
Result:
- Core-cracking defect rate reduced from 5% to 0%
- Thermal conductivity 2.0 W/m·K vs. epoxy 1.0 W/m·K
- Transformer temperature drop of 8℃; efficiency improved by 0.5%
- Reworkability changed from non-reworkable to reworkable
Case 3: Rail Transit Traction Converter Cooling
Customer background:
A traction-system supplier under CRRC
Requirement:
Traction IGBT cooling grease must meet EN 45545 + 30-year life + vibration resistance
Solution:
MT-3206 ultra-high-thermal-conductivity grease with custom anti-vibration formulation
Result:
- Passed EN 45545 HL3 fire-safety certification
- Oil bleed <0.1% after 2000 h vibration fatigue
- With liquid cooling, IGBT junction temperature <80℃
- Completed 30-year accelerated-aging validation
Case 4: Industrial Sensor IP69K Sealing
Customer background:
Sensor supplier for automotive welding lines
Requirement:
Housing with IP69K protection; resistant to 80℃ high-pressure water jet cleaning
Solution:
MT-704A high-adhesion sealant + O-ring assistance
Result:
- Passed IP69K high-pressure water-jet cleaning test
- Sealing life extended from 1 year to 5 years
- Passed 1000 h resistance to industrial cleaning agents
13. Technical Service System
13.1 Pre-Sales Service
Service Item
Content
Response Time
Technical Consultation
Selection + solution + thermal simulation
Within 2 hours
Free Samples
Trial samples matched to customer devices
Within 24 hours
Application Testing
Full-system prototyping / thermal testing
3 business days
Process Solution
Application process + SOP
5 business days
On-Site Visit
Technical exchange + production-line review
Within 1 week
13.2 In-Sales Service
- First-lot on-site support: engineers provide on-site guidance for potting/coating processes
- Operation training: SOP preparation + on-site training
- Equipment integration: provide dispensing/potting/coating equipment parameters
- Safety documentation: full set of UL/TÜV/EN 45545 documents
13.3 After-Sales Service
- Quarterly follow-up: quality review + joint assessment
- Batch traceability: 5-year retained samples + full records
- Failure analysis: 24 h response + 8D report
- Technology upgrade: pre-research on next-gen wide-bandgap device formulations
We are committed to providing professional, integrated thermal-conductivity, potting, insulation, and protection solutions for the industrial electronics industry.
