Scope: New energy vehicles, smart cockpit, three-electric systems and ADAS across the entire value chain

1. Automotive Electronics Industry Overview

1.1 Automotive Electronics Industry Trends

The global automotive electronics industry is undergoing profound transformation. In 2025 the global automotive electronics market exceeded USD 400 billion, with new energy vehicle (NEV) electronics accounting for more than 45%. The four megatrends of the automotive industry — electrification, intelligence, connectivity and shared mobility — are accelerating, driving the electronics share of total vehicle value from 25% in conventional ICE vehicles to over 55% in NEVs.

Electrification has sharply increased demand for thermally conductive, insulating and sealing materials across the "three electrics" (battery, motor, controller), while the shift toward intelligence has created new protection requirements for ADAS sensors, domain controllers and smart cockpit modules. As critical enabling materials, automotive silicones play an irreplaceable role in thermal management, protective sealing and vibration damping.

1.2 Specific Requirements for Silicones in Automotive Electronics

The automotive electronics industry imposes extremely demanding requirements on silicone materials, principally:

Requirement

Specification

Automotive Standard

Reliability

Service life ≥15 years / 300,000 km

AEC-Q100/200

Temperature Resistance

Operating temperature -40℃ to 150℃ (≥175℃ in certain zones)

LV124 / ISO 16750

Vibration Resistance

20G random vibration; 5–200Hz sweep vibration

ISO 16750-3 / ECE R100

Flame Retardancy

UL94 V-0 / 5VA

FMVSS 302 / GB 8410

Chemical Resistance

Resistant to coolant, engine oil and battery electrolyte

PV 1200 / DBL 5407

Low VOC

Odour ≤ grade 3; total carbon ≤50μgC/g

VDA 270 / VDA 277

Low Ionic Content

Cl⁻ ≤10ppm，Na⁺ ≤10ppm

Reliability and corrosion-prevention requirement

1.3 Mapping Silicone Demand Across the Automotive Electronics Value Chain

Three-electric systems:  Battery pack (structural adhesive / thermally conductive potting compound / thermal grease / sealant)  Motor (thermal grease / potting compound / housing sealant)  Controller & inverter (thermal grease / potting compound / PCB conformal coating). Intelligent systems:  Domain controller & cockpit SoC (thermal grease / thermal pad)  ADAS sensors (low-stress potting compound / sealant)  LiDAR & camera (precision potting / optical bonding). Body electronics:  Lighting (thermal grease / sealant)  OBC and DC-DC (thermally conductive potting compound / thermal grease)  Thermal management system (thermal pad / sealant).

2. Product Portfolio Overview

2.1 Core Product Series

Product Series

Product Name

Typical Model

Key Features

Thermal Grease

Automotive-grade high thermal conductivity grease

MT-3202/3204/3205

Thermal conductivity 1.0–4.6 W/m·K, low oil bleed, long service life

Thermally Conductive Potting Compound

Two-component addition-cure potting compound

MT-2803/2807/2808

Thermal conductivity 0.5–2.0 W/m·K, UL94 V-0 flame retardant, low stress

Structural Adhesive

Silicone structural adhesive

MT-1301

High bond strength, vibration resistant, wide temperature resistance

Sealant

Oil-resistant silicone sealant

MT-6655

Resistant to ATF and coolant, IP69K

Low-Stress Potting Compound

Gel-type potting compound

MT-4203

Ultra-low stress, reworkable, precision protection

2.2 Automotive Certifications and Compliance

IATF 16949 quality management system certification

AEC-Q (reliability test standard for electronic components)

UL 94 V-0 flame retardancy certification

RoHS / REACH / ELV environmental compliance

VDA 270 odour test ≤ grade 3

VDA 277 total carbon emission ≤50μgC/g

Cl⁻ / Na⁺ / K⁺ ionic content ≤10ppm (Grade 3 water specification)

ISO 16750 environmental condition testing for road vehicles

3. Traction Battery System Solutions

Figure 3-1 ADAS sensor sealing and BMS thermal management solution

Figure 3-2 On-board charger (OBC) thermal management and MCU sealing

3.1 Battery Pack Structural Bonding Solution

Application areas: cell-to-cell, cell module-to-housing, and top cover-to-enclosure interfaces

Recommended products: MT-1301 silicone structural adhesive | MT-6655 sealant

Application

Recommended Product

Function

Key Requirements

Cell-to-cell bonding

MT-1301

Structural reinforcement and cushioning

Thermal conductivity ≥0.8 W/m·K, flexible elastic bond

Cell-to-base plate bonding

MT-1301

Fixing and temperature equalisation

High bond strength, thermal conductivity 1.0–2.0 W/m·K

Top cover sealing

MT-6655

IP68 / IP69K sealing

Coolant resistant, low VOC, foam sealing

Busbar insulation

Insulation protection and creepage prevention

Withstand voltage ≥3kV, electrolyte resistant

3.2 Battery Thermal Management Solution

Recommended product: MT-3204 thermal grease

Heat Dissipation Path

Recommended Solution

Typical Specification

Expected Temperature Reduction

Cell ⇌ liquid cooling plate

MT-3204 thermal grease

Coating thickness 100–200μm

Interface temperature difference ≤2℃

Module ⇌ bottom housing

TSP thermal pad

2–4mm thickness, 40–60% compression

Equivalent thermal resistance as low as 0.5 ℃·cm²/W

Inter-cell heat dissipation

MT-2808 potting compound filling

Potting gap 3–8mm

Cell-to-cell temperature difference ≤3℃

Busbar heat dissipation

TSP thermal pad

1–2mm, with adhesive backing

Joint temperature reduced by 15℃

3.3 Battery Potting Safety Solution

Application area: inside the battery module, filling gaps between cells

Recommended product: MT-2808 high thermal conductivity flame-retardant potting compound

Function

Method

Performance

Thermal runaway delay

UL94 V-0 flame retardant, self-extinguishing, thermal isolation

Passes thermal propagation test (≥5 min)

Thermal balancing

High thermal conductivity filling of inter-cell gaps

Temperature difference ≤3℃, peak temperature reduced by 8–12℃

Vibration damping

Elastomer absorbs vibration and shock

Meets ECE R100 vibration and shock testing

Water and dust protection

Full encapsulation with no voids

IP68 (1m immersion for 24h)

Electrical insulation safety

High dielectric strength

Dielectric strength ≥18kV/mm, withstand voltage 6kV

Key potting process points:

1. After the cell module is placed in the housing, clean off dust and oil contamination
2. Calculate dispensing volume based on gap size; limit each pour to ≤30mm thickness
3. Use low-pressure assisted potting to avoid entrapped air bubbles
4. Pre-cure 4h at room temperature, then full cure at 80℃ × 2h
5. After curing, withstand voltage test ≥3kV with no breakdown

4. E-Drive System Solutions

4.1 Traction Motor Thermal Management Solution

Application areas: stator winding end turns, hairpin winding weld joints, magnet-to-rotor core interface

Location

Recommended Product

Function

Process

Stator end winding

MT-2803 thermally conductive potting compound

Heat dissipation and winding fixation

Impregnation / trickle potting + heat cure

Hairpin weld joints

Insulation protection and corrosion prevention

Selective coating

Magnet bonding

MT-1301 structural adhesive

High-strength fixation, demagnetisation prevention

Heat cure at 80℃ / 30 min

Housing coolant channel sealing

MT-6655 sealant

Watertight sealing, coolant resistant

FIPG (formed-in-place gasket)

4.2 Motor Controller Thermal Management Solution

Application areas: interface between IGBT/SiC power module baseplate and heat sink; DC-link capacitor cooling

Recommended product: MT-3204 high thermal conductivity grease

Parameter

MT-3204

Industry Requirement

Assessment

Thermal conductivity

3.7 W/m·K

≥3.0

Exceeds ✓

Thermal resistance (100psi)

0.045 ℃·cm²/W

≤0.1

Excellent ✓

Oil bleed (175℃/24h)

<0.3%

≤1%

Excellent ✓

Operating temperature

-55℃~250℃

-40℃~175℃

Ample margin ✓

Ionic content (Cl⁻ + Na⁺)

≤15ppm

≤50ppm

Clean ✓

Viscosity

320,000 cP

Matched to dispensing equipment

Adjustable ✓

4.3 OBC / DC-DC Potting Solution

Application area: inside on-board chargers (OBC) and DC-DC converters. Recommended product: MT-3803 two-component thermally conductive potting compound

Technical requirements:

• Low ionic content: reduces the risk of ion migration
• Low-stress cure: protects BGA solder joints and sensitive components
• High thermal conductivity: supports 6.6kW–22kW power density cooling
• UL94 V-0 flame retardancy: meets automotive safety requirements

5. Electronic Control System Solutions

5.1 VCU / Domain Controller Thermal Management Solution

Application area: between the main SoC (e.g. 8155/8295) and the heat-dissipating housing. Recommended product: MT-3202 thermal grease

Comparison Item

MT-3202 thermal grease

Thermal conductivity

2.0 W/m·K

Applicable gap

50~200μm

0.5~5mm

Application method

Stencil printing / dispensing

Pad placement

Reworkability

Requires cleaning and re-application

Can be re-applied

Recommended use

Flat mating surfaces, high-volume automated production

Multiple chips with height variation, low-volume production

5.2 PCB Conformal Coating Protection Solution

Application area: PCBs of body controllers such as VCU, BCM, gateway and T-Box

Automotive-grade protection requirements:

• Moisture resistance: 85℃/85%RH for 1000h, insulation ≥100MΩ
• Salt spray resistance: 144h neutral salt spray with no blistering or delamination
• Fungus resistance: ASTM G21, grade 0 (military standard)
• Thermal shock resistance: -40℃ ↔ 125℃, 500 cycles with no cracking
• Coating thickness: 30–80μm, uniform and consistent
• UV tracer: coverage visually inspectable under 365nm UV light

6. Smart Cockpit and Automotive Lighting Solutions

6.1 Smart Cockpit Thermal Management Solution

Application Area

Heat Source

Recommended Solution

Key Requirements

Instrument cluster / centre display

Backlight driver IC, GPU

MT-3202 thermal grease

High viscosity, non-slump

Head-up display (HUD)

DLP / DMD chip

MT-3204 thermal grease

High thermal conductivity 3–5 W/m·K

MT-3202 thermal grease

Thin-layer coating

6.2 Automotive Lighting System Solution

Application areas: LED matrix headlamps, tail lamp light modules, driver modules

Application

Recommended Product

Technical Requirements

LED light source cooling

MT-3202 thermal grease

Thermal conductivity ≥2.0 W/m·K, temperature resistance 150℃

Driver module potting

MT-2803 potting compound

Room-temperature cure, UL94 V-0 flame retardant

Lamp housing sealing

MT-6655 sealant

IP69K waterproofing, UV weather resistance

Lens bonding

MT-705B structural adhesive

Light transmittance ≥90%, low shrinkage

7. ADAS and Sensor System Solutions

7.1 Millimetre-Wave Radar Solution

Application areas: radome bonding, PCB potting, heat dissipation

Application Area

Recommended Product

Key Specifications

Radome bonding

MT-1301 (low dielectric)

Dielectric constant ≤2.8, Df ≤0.005

PCB potting protection

MT-2803 low-stress grade

Hardness Shore A 20–30, reworkable

Back-end heat dissipation

MT-3202

Thermal conductivity 2.0 W/m·K, low ionic content

Housing sealing

MT-6655

IP69K water and dust protection

7.2 LiDAR Solution

Application areas: potting of laser emitter and receiver modules, optical lens bonding. Recommended product: MT-4203 gel-type potting compound (ultra-low stress, reworkable)

Key characteristics:

• Ultra-low modulus: cured elastic modulus <0.1MPa, zero impact on optical alignment
• Ultra-low shrinkage: cure shrinkage <0.1%
• High transparency: visible light transmittance >92%
• Reworkable: the gel can be mechanically removed for easy repair
• Wide temperature range: optical stability from -50℃ to 200℃

7.3 Camera Module Solution

Application areas: camera module potting, lens holder bonding, image sensor cooling. Recommended products: MT-3803 (low stress) / MT-3202

8. Selection Guide and Technical Data Comparison

8.1 Quick Selection Matrix

Application

Primary Requirement

Recommended Product

Alternative Product

Battery pack structural bonding

High strength + thermal conductivity

MT-1301

MT-2808

Battery potting and cooling

Flame retardancy + thermal conductivity

MT-2808

MT-2803

Cell ⇌ liquid cooling plate heat transfer

Low thermal resistance + long service life

MT-3204

IGBT / SiC module cooling

Ultra-high thermal conductivity

MT-3204

—

OBC / DC-DC potting

Low stress + UL94 V-0

MT-2803

MT-2808

Domain controller chip cooling

Medium-to-high thermal conductivity

MT-3202

PCB conformal coating protection

Moisture + salt spray resistance

—

LiDAR potting

Low stress + reworkable

MT-4203

MT-2803

Motor stator potting

Thermal conductivity + fixation

MT-2803

—

Lamp module cooling

Thermal conductivity + temperature resistance

MT-3202

Millimetre-wave radar sealing

Low dielectric constant + IP69K

MT-6655

MT-1301

Camera module protection

Low stress + anti-fogging

MT-4203

8.2 Thermal Product Selection Map

Thermal material selection principles for automotive electronics:  Die level (gap <100μm) → thermal grease MT-3204 / MT-3202  Chip level (gap 0.1–0.5mm) → thermal pad TSP-100/200  Module level (gap 0.5–5mm) → thermal pad TSP-300/500  Full encapsulation (multiple components, large gaps) → thermally conductive potting compound MT-3803 / MT-2808

9. Competitive Advantages

9.1 Technical Advantages

Automotive-grade quality control: IATF 16949 process-wide quality management with full batch traceability

Low-ion technology: proprietary purification process, Cl⁻/Na⁺/K⁺ ≤10ppm, eliminating electrochemical migration

Low volatility and low odour: VDA 270 odour ≤ grade 2.5, VDA 277 total carbon ≤30μgC/g

Custom formulation: viscosity, cure speed, hardness and colour tailored to the customer's equipment and process

Full-chain testing: thermal cycling (-55℃ to 175℃), damp-heat ageing, thermal shock, corrosion and vibration

9.2 Quality Advantages

Quality Metric

Common Industry Standard

Maxtor Control Level

Batch Cpk

≥1.33

≥1.67

Thermal conductivity tolerance

±0.2 W/m·K

±0.15 W/m·K

Viscosity tolerance

±20%

±10%

Hardness tolerance

±10 Shore

±5 Shore

Ionic content

≤100ppm

≤10ppm (Grade 3 water)

Colour variation

ΔE≤2.0

ΔE≤1.0

10. Case Studies

Case 1: Pack potting for a leading traction battery manufacturer

Customer background:

A top-2 Chinese traction battery manufacturer, prismatic aluminium-can cells, CTP architecture

Requirement:

Inter-cell gap potting meeting UL94 V-0, thermal conductivity ≥1.0 W/m·K and 15-year vibration durability

Solution:

Customised MT-2808 formulation with an optimised flame-retardant system to reduce cost

Results:

• Cell-to-cell temperature difference reduced from 5.5℃ to 2.5℃
• Passed nail penetration testing and 3,000 thermal cycles
• Annual consumption exceeded 500 tonnes
• Became a Class A supplier to this customer

Case 2: E-drive cooling upgrade at an NEV OEM

Customer background:

A well-known Chinese NEV manufacturer, 200kW e-drive platform

Requirement:

SiC module cooling bottleneck; junction temperature had to be reduced by 20℃ with thermal resistance ≤0.05 ℃·cm²/W

Solution:

MT-3204 replaced an imported thermal grease brand

Results:

• SiC junction temperature reduced by 22℃; peak power increased by 15%
• Thermal resistance rose only 2.5% after 4,000 thermal cycles
• Cost reduced by 30%; lead time shortened from 12 weeks to 3 weeks

Case 3: ADAS domain controller cooling solution for a Tier 1 supplier

Customer background:

An international Tier 1 supplier, Qualcomm Snapdragon Ride platform domain controller

Requirement:

The SoC thermal material had to meet AEC-Q qualification, deliver 3.0 W/m·K and withstand at least 5 rework cycles

Solution:

Results:

• SoC core temperature reduced by 18℃
• Passed AEC-Q qualification and the Tier 1's internal standards
• Awarded global nominated supplier status for the platform

11. Technical Service System

11.1 Pre-Sales Service

Service

Scope

Response Time

Technical consultation

Product selection and application solution design

Within 2 hours

Free samples

Trial samples matched to customer requirements

Within 24 hours

Application testing

Trial application and testing on customer samples

Within 3 business days

Solution design

Preparation of a tailored application process plan

Within 5 business days

On-site visit

Pre-sales technical exchange and production line review

Arranged within 1 week

11.2 Service During Implementation

• On-site support for first mass production: technical guidance to ensure a smooth ramp-up
• Operator training: standard operating procedures (SOP) and on-site training provided
• Equipment integration: parameter packages for automatic dispensing and potting equipment
• PPAP submission: PPAP documentation package provided in line with IATF 16949

11.3 After-Sales Service

• Quarterly quality review: technical and quality review visit every quarter
• Full batch traceability: samples retained for 5 years with complete production records
• Failure analysis: response within 24 hours with an 8D corrective action report
• Technical upgrades: ongoing VAVE cost-reduction and material upgrade proposals

We are committed to providing the automotive electronics industry with complete professional solutions for thermal management, sealing and potting